Welcome friends In this video, I’ll show you Electroless copper plating on
Glass and PCB substartes Tin-Palladium Activator
(See my previous videos) Distill Water Copper plating bath
(See my previous videos) 0.1 mol NaOH (Caustic Soda)
0.1gm NaOH in 25ml DI water Calibrate pH meter to 13.0 pH Adjust copper bath pH to a value
greater than 12.5 by adding NaOH solution Make it approx 13.0 pH
Our is at 12.9 pH Dip cleaned glass slide in
Activator for approx 4 to 5 minutes. Dip activated glass slide in
distilled water for another 4 to 5 minutes. Dip hydrolized glass
slide in copper bath Watch 4 to 5 min.
If copper does not start depositing. Add formalin. Add formalin in 0.05ml increments and watch again
for 2 – 3 mins befor adding more formalin. Excess of formalin will instantly decompose copper bath.
So have patience…!!! Copper plated on Glass substrate.
Glass slide was not properly cleaned. Lets plate copper on PCB substrate. Perform same step for PCB substarte. Check copper deposition on di-electric surface. Electric continuity check at hole wall.
This is know as PTH (Plated through hole) You can electro plate copper for final product. Plating quality depends upon surface prepration. Commerical bath contains brightners and additives
for bright and ductile copper deposition If you find it helpful and informative
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