Pyrolytic Graphite Sheet vs Copper


From heat sinks to thermal pace, thermal
management in electronic devices has long been a battle waged by design engineers.
As the size of devices are decreasing, and power consumption increasing, common
methods of heat transfer failing to meet the needs of today’s designs. A traditional
solution like copper, is slowly losing its position in today’s thermal market.
With a thermal connectivity rating of roughly 400 watts per meter Kelvin, copper
doesn’t move heat fast enough for its size and weight. Copper’s high density characteristics
also make it a weak solution for light weight designs. Standard gap pads are also another
type of solution used today that does not move heat fast enough for its size,
limiting its applications. Because of these limitations, an advanced thermal solution
is increasingly necessary. To address today’s thermal solutions, Panasonic has developed a
new heat spreading material called Pyrolytic Graphite Sheet material, better known
as PGS. Panasonic PGS has roughly five times the thermal connectivity of copper, while having a quarter
of its density, so you’re left with the lightweight material that performs much better
for heat dissipation. The thickness of PGS ranges from 10 to 100 microns, and because of
the increased thermal connectivity, it’s possible to do away with the gap pad entirely, giving
you a lot more latitude in the thickness of your device. PGS is also highly flexible. It
could withstand over 100,000 bend cycles at a radius of 5 millimeters. This gives you the
ability to bend the material around sharp corners, or even cover two sides of a circuit board as
a heat pipe. So whether you need a material for heat transport, thermal diffusion, or just
heat reduction, take a long look at Panasonic PGS. If you’d like to put PGS to the test, click on
the link at the end of this video to get a free demonstration strip, so you can see
first hand the benefits of PGS over copper.

Be the first to comment

Leave a Reply

Your email address will not be published.


*